DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Ahn, EC

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 7 of 7

1
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments

Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04

2
Adhesion reliability of Cu-Cr alloy films to polyimide

Ahn, EC; Yu, Jin; Oh, TC; Park, IS, Proceedings of the 1996 MRS Spring Symposium, pp.67 - 71, MRS, 1996-04-08

3
Adhesion strength of CuCr alloy films to polyimide

Ahn, EC; Yu, Jin; Park, IS, Spring Meeting on MRS, v.390, pp.55 - 60, 1995-04-17

4
Adhesion study of copper and chromium films to polyimide

Chung, TG; Yu, Jin; Kim, YH; Ahn, EC; Park, IS, Proceedings of the Fall 1993 MRS Meeting, v.323, pp.377 - 382, 1993-11-29

5
Cohesive failure of the Cu/polyimide system

Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04

6
Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide

Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE, v.35, no.8, pp.1949 - 1955, 2000-04

7
Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide

Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.3, pp.175 - 179, 1996-06

Discover

rss_1.0 rss_2.0 atom_1.0