Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthor1052

Showing results 1 to 60 of 238

1
20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wookresearcher, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21

2
3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs)

Choi, Yongwon; Shin, Jiwon; Paik, Kyung-Wookresearcher, The 62nd Electronic Components and Technology Conference, ECTC, 2012-05

3
A study on B-stage CNT/epoxy composite films for electronic packaging applications

Paik, Kyung-Wookresearcher; Han, SH, 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, pp.2755 - 2758, Materials Australia, 2010-08-02

4
A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure)

Kim, HJ; Paik, Kyung-Wookresearcher; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01

5
A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates

Jang, KW; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30

6
A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

Choi, Y; Shin, J; Paik, Kyung-Wookresearcher, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1126 - 1129, ECTC, 2011-05-31

7
A Study on the Double layer Non Conductive Films (D-NCFs) For Highly Reliable Fine Pitch Flip ChipInterconnection

Lee, Seyong; Paik, Kyung Wookresearcher, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25

8
A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film (ACF) for LCD Packaging Applications

백경욱researcher; 임명진, 97 1st ISHMIEEECPMT Joint Symposium, pp.25 - 32, 1997-04-01

9
A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film(ACF) for LCD Packaging Applications

Paik, Kyung-Wookresearcher; Yim, MJ; Kim, YK; Hwang, HN, InterPACK'97, pp.65 - 72, 1997-06-01

10
Adhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish

Kim, HJ; Paik, Kyung-Wookresearcher, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1707 - 1713, IEEE, 2007-05-29

11
Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09

12
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

13
Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wookresearcher, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11

14
Anisotropic Conductive Adhesives Flip Chip Technology

Paik, Kyung-Wookresearcher, Asymtek & Tsinghua University Workshop, pp.0 - 0, 2001-05-01

15
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wookresearcher, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01

16
Anisotropic conductive film (ACF) interconnection for display packaging applications

Yim, Myung-Jin; Paik, Kyung-Wook; Kim, Tae-Sung; Kim, Yang-Kook, Proceedings of the 1998 48th Electronic Components & Technology Conference, pp.1036 - 1041, 1998-05-25

17
Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application

Yim, MJ; Kwon, WS; Paik, Kyung-Wookresearcher, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01

18
Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications

Yim, MJ; Hwang, J; Paik, Kyung-Wookresearcher, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.181 - 186, 2005-03-16

19
Anisotropic Conductive Films with Area-arrayed Conducting Microbumps

Paik, Kyung-Wookresearcher, International Conference on Electronic Materials, pp.139 - 139, 1998-03-01

20
Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)

Paik, Kyung-Wookresearcher; Jeon, YD; Nah, JW, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184, 2001-07-08

21
Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

Kwon, YM; Jeon, YD; Paik, Kyung-Wookresearcher; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07

22
Au wire와 AI pad간의 계면 반응과 접합신뢰성에 있어서의 첨가원소 Pd과 Cu의 영향

백경욱researcher; 감상아; 김형준; 조종수; 김성훈; 박용진, 한국 마이크로 전자 및 패키징 학회 (IMASPS-Korea) 2005년도 추계기술심포지움, pp.196 - 201, 2005

23
Bio-inspired Surface Treatment on Touch Screen Panels (TSPs) for Adhesion Enhancement

Kim, Il; Kim, Seung-Ho; You, Inseong; Lee, Haeshin; Paik, Kyung-Wookresearcher, The 62nd Electronic Components and Technology Conference, 2012-05

24
Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability

Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wookresearcher, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07

25
Bumpless ball grid array (BBGA) package using a solder resist cavity

Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wookresearcher, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26

26
Characteization of Polymer die-Attach Adhesives on Au and Al surfaces

Paik, Kyung-Wookresearcher; krishnamurthy; Lester, D, Proceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference, pp.719 - 724, 1992

27
Characteristics of fine patterned epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrates

Hyun, JG; Paik, Kyung-Wookresearcher, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1027 - 1032, IEEE, 2007-05-29

28
Characterization of coined solder bumps on PCB pads

Nah, JW; Paik, Kyung-Wookresearcher; Kim, WH; Hur, KR, 52nd Electronic Components and Technology Conference, pp.154 - 160, IEEE, 2002-05-28

29
Characterization of Epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors

Hyun, JG; Paik, Kyung-Wookresearcher; Pak, JS, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.2046 - 2050, 2009-05-26

30
Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems

Jang, Se-Young; Paik, Kyung-Wookresearcher, 50th Electronic Components and Technology Conference, pp.64 - 68, IEEE, 2000-05-01

31
Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

Jeon, YD; Ostmann, A; Reichl, H; Paik, Kyung-Wookresearcher, 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208, IEEE, 2003-05-27

32
Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint

Paik, Kyung-Wookresearcher; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; et al, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01

33
Conduction mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor ball deformation and build-up of contraction stresses

Kwon, WS; Paik, Kyung-Wookresearcher, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.214 - 220, 2005-03-16

34
Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구

백경욱researcher, The Microelectronics and Packaging Society, IMAPS-Korea Workshop 2001, pp.95 - 99, The Microelectronics and Packaging Society, 2001-07-01

35
Cu/Al 금속간화합물 형성이 구리와이어의 본딩신뢰성에 미치는 영향

김형준; 이주연; 나재웅; 백경욱researcher, 대한금속 재료학회 2001년도 추계학술대회, pp.73 - 73, 대한금속 재료학회, 2001-10-01

36
Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wookresearcher, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29

37
Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection

Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30

38
Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications

Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30

39
Design and understanding of anisotropic conductive films (ACFs) for LCD packaging

Yim, Myung-Jin; Paik, Kyung-Wookresearcher, Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging, PEP'97, pp.233 - 242, 1997-10-26

40
Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10

41
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003

42
Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wookresearcher, The 62nd Electronic Components and Technology Conference, 2012-05

43
Development of New 3-Dimensional (3-D) Memory Die Stacking Package

백경욱researcher, 제6회 한국반도체 학술대회, pp.271 - 272, 한국반도체 학술대회, 1999-02-01

44
Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging

Paik, Kyung-Wookresearcher, Proc. Mat. Res. Soc. Symp, pp.21 - 26, 1989-03-01

45
Development of Three-Dimensional Memory Die Stack Packages Using Polymer Insulated Sidewall Technique

Paik, Kyung-Wookresearcher, 49th Electronic Components and Technology Conference, pp.0 - 0, IEEE, 1999-06-01

46
Development of Uranium-Silicide and U-Mo Alloy Fuels by Centruifugal Atomization

Paik, Kyung-Wookresearcher, Technical Committee on Research fo Fuel Aimed by Low Fission Gas Release, pp.0 - 0, 1996-10-01

47
Effect of compressive stresses in Anisotropic Conductive Films (ACFs) on contact resistance of flip chip joint

Paik, Kyung-Wookresearcher; Kwon, WS, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.141 - 147, 2004-09-12

48
Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications

Yim, MJ; Chung, CK; Paik, Kyung-Wookresearcher, IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0, 2006-03-15

49
Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints

Kwon, YM; Paik, Kyung-Wookresearcher, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19

50
Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging

Park, YS; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wookresearcher, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1870 - 1877, ECTC, 2011-05-31

51
Effect of non-conducting filler additions on anisotropic conductive adhesives properties and the reliability of ACAs flip chip on organic substrates

Yim, Myung-Jin; Paik, Kyung-Wookresearcher, 50th Electronic Components and Technology Conference, pp.899 - 905, 2000-05-01

52
Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface

Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 60th Electronic Components and Technology Conference, ECTC 2010, pp.329 - 335, ECTC, 2010-06-01

53
Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish

Park, YS; Kwon, YM; Son, HY; Moon, JT; Jeong, BW; Kang, KI; Paik, Kyung-Wookresearcher, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0 - 0, 2007-11-19

54
Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages

Jang, KW; Paik, Kyung-Wookresearcher, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19

55
Effects of BaTiO3 Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitor Fabrication in Organic Substrates

Cho, Sung-Dong; Jang, Kyung-Woon; Hyun, Jin-Gul; Paik, Kyung-Wookresearcher, 2004 Pan Pacific Microelectronics, pp.109 - 115, 2004

56
Effects of BaTiO3 content and size on the viscosity and curing behavior of B-stage Epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs)

Jang, Jong Min; Lee, Sangyong; Paik, Kyung-Wookresearcher, The 11th International Conference on Electronic Materials and Packaging, 2009-12

57
Effects of bonding parameters and ACF material properties on the ACF joint morphology in ultrasonic bonding

Kim, YS; Lee, K; Kim, WC; Paik, Kyung-Wookresearcher, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1917 - 1921, ECTC, 2011-05-31

58
Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications

Zhang, Shuye; Park, Jae Hyeong; Paik, Kyung Wookresearcher, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25

59
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad boundability

Kim, HJ; Lee, YJ; Paik, Kyung-Wookresearcher; Koh, KW; Woon, JH; Choi, SH; Lee, J; et al, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, 2001-11

60
Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

Nah, JW; Suh, JO; Paik, Kyung-Wookresearcher; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16

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