DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Lee, JK

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 10 of 10

1
A Comparative Study of Finite Element Solutions of Solidification by Temperature Recovery Method

Im, Yong-Taek; Chen, YH; Lee, JK; Lee, ZH, TRANSACTIONS OF THE AMERICAN FOUNDRYMEN'S SOCIETY, pp.299 - 304, 1991-04

2
A study on the conduction path in undoped polycrystalline diamond films

Lee, BJ; Ahn, Byung Tae; Lee, JK; Baik, YJ, DIAMOND AND RELATED MATERIALS, v.10, no.12, pp.2174 - 2177, 2001-12

3
Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29

4
Effects of Zr addition on the phase stability of L1(2)-based Al-Ti-Cr alloys

Chun, DH; Lee, JK; Oh, MH; Wee, Dang-Moon, MATERIALS LETTERS, v.59, no.23, pp.2923 - 2927, 2005-10

5
Long-term oxidation properties of Al-Ti-Cr two-phase alloys as coating materials for TiAl alloys

Lee, JK; Oh, MH; Wee, Dang-Moon, INTERMETALLICS, v.10, no.4, pp.347 - 352, 2002-04

6
Microstructure control in two-phase Al-21Ti-23Cr alloy

Lee, JK; Park, JY; Oh, MH; Wee, Dang-Moon, INTERMETALLICS, v.8, no.4, pp.407 - 416, 2000-04

7
Plasma-sprayed Al-21Ti-23Cr coating for oxidation protection of TiAl alloys

Lee, JK; Oh, MH; Lee, HK; Wee, Dang-Moon, SURFACE COATINGS TECHNOLOGY, v.182, no.2-3, pp.363 - 369, 2004-04

8
Strain relaxation via interface nucleation of misfit dislocations in intermixing layers

Park, HyoHoon; Lee, JK; Lee, EH; Lee, JeongYong; Hong, SK, MRS Symposium 1992, pp.479 - 487, MRS, 1992-05-01

9
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

10
Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

Discover

rss_1.0 rss_2.0 atom_1.0