Showing results 1 to 1 of 1
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection Kim, Jungkyun; Rhee, Hakseung; Son, Myeong Won; Park, Juseong; Kim, Gwangmin; Song, Hanchan; Kim, Geunwoo; et al, ACS APPLIED ELECTRONIC MATERIALS, v.5, no.5, pp.2447 - 2453, 2023-04 |
Discover