Showing results 10941 to 10960 of 19424
Nucleation enhancement of diamond by electric arcing Choi, K; Hwang, NM; Kang, Suk-Joong L, DIAMOND AND RELATED MATERIALS, v.7, no.11-12, pp.1617 - 1622, 1998-12 |
Nucleation mechanism of carbon nanotube Han, SS; Lee, KS; Lee, HyuckMo, CHEMICAL PHYSICS LETTERS, v.383, no.3-4, pp.321 - 325, 2004-01 |
Nucleation of an Elliptic Dislocation Loop from a Crack Tip Yu, Jin, The Japan Institude of Metals, pp.399 - 402, 1994-06-01 |
Nucleation of liquid Pb-phase in hypermonotectic Al-Pb melt and the segregation of Pb-drops in melt-spun ribbon SUH, YC; Lee, Zin-Hyoung, SCRIPTA METALLURGICA ET MATERIALIA, v.33, no.8, pp.1231 - 1237, 1995-10 |
Nucleation reactions and film growth of copper on TiN using hexafluoroacetylacetonate copper(I) trimethylvinylsilane Kim, DH; Lee, YJ; Park, Chong-Ook; Park, JW; Kim, JJ, CHEMICAL ENGINEERING COMMUNICATIONS, v.153, pp.307 - 317, 1996-06 |
Nucleation, growth, and phase transformation mechanism of Ge2Sb2Te5 thin films Kim, Eun Tae; Lee, JeongYong; Kim, Yong Tae, PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, v.206, no.11, pp.2542 - 2545, 2009-11 |
Nucleation, growth, and superlattice formation of nanocrystals observed in liquid cell transmission electron microscopy Chen, Qian; Yuk, Jong Min; Hauwiller, Matthew R.; Park, Jungjae; Dae, Kyun Seong; Kim, Jae Sung; Alivisatos, A. Paul, MRS BULLETIN, v.45, no.9, pp.713 - 726, 2020-09 |
Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads Zhang, Shuye; Sun, Mingjia; Yang, Jianqun; Li, Xingji; He, Peng; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.1, pp.26 - 33, 2023-01 |
Numerical analysis of Marargoni convection in floating zone melting under gravity-free condition T.J.Kim; Y.s.Choe; Lee, Zin-Hyoung; C.S.Kang; H.K.Baik, 대한금속·재료학회지, v.29, no.3, pp.220 - 228, 1991 |
Numerical Analysis of the Formation of Coined Solder Bumps Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 |
Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delaminationin Plastic Packages under Thermal and Vapor Pressure Holding 박영배; 유진, 마이크로전자 및 패키징학회지, v.5, no.2, pp.37 - 48, 1998-12 |
Numerical simulation of stress-strain curve of duplex stainless steel Yang, Q.-X.; Wu, J.; Zhao, H.; Park, Joong Keun, CAILIAO RECHULI XUEBAO/TRANSACTIONS OF MATERIALS AND HEAT TREATMENT, v.26, no.5, pp.124 - 128, 2005-10 |
Numerical simulation of the stress-strain curve and the stress and strain distributions of the titanium-duplex alloy Zhao, XQ; Zang, XL; Wang, QF; Park, Joong Keun; Yang, QX, RARE METALS, v.27, no.5, pp.463 - 467, 2008-10 |
Numerical simulation on distribution of micro stress-strain in dual-phase titanium alloys Zang X.; Zhao X.; Yang Q.; Park, Joong Keun; Gao Y., XIYOU JINSHU CAILIAO YU GONGCHENG/RARE METAL MATERIALS AND ENGINEERING, v.38, no.6, pp.1058 - 1061, 2009-06 |
Numerical Simulation on residual stress distribution of hard-face-welded steel specimens with martensite transformation Yang, QX; Yao, M; Park, Joong Keun, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.364, no.1-2, pp.244 - 248, 2004-01 |
Numerical simulation on the microstress and microstrain of low Si-Mn-Nb dual-phase steel Dong, Hai-feng; Li, Jing; Zhang, Yue; Park, Joong Keun; Yang, Qing-xiang, INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, v.17, no.2, pp.173 - 178, 2010 |
Numerical simulations and measurements of temperature and stress field in medium-high carbon steel specimen after hard-face-welding Yang, QX; Yao, M; Park, Joong Keun, COMPUTATIONAL MATERIALS SCIENCE, v.29, no.1, pp.37 - 42, 2004-01 |
Numerical study of spin relaxation by thermal fluctuation: Effect of shape anisotropy Lee, Kyung-Jin; Park, NY; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.89, no.11, pp.7460 - 7462, 2001-06 |
O-2 plasma oxidation of sputter-deposited Cu thin film during photo resist ashing Kwon, MS; Lee, JeongYong, APPLIED SURFACE SCIENCE, v.135, no.1-4, pp.101 - 106, 1998-09 |
O2/CF4 ECR 플라즈마를 이용한 RuO2박막의 건식식각 기구 연구 이원종; 이응직; 김종삼, 한국재료학회 추계학술연구발표회, pp.0 - 0, 1996-01-01 |
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