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Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system Park, Young Bae; Yu, Jin, METALS AND MATERIALS-KOREA, v.7, no.2, pp.123 - 131, 2001-04 |
Phase angle in the Cu/polyimide/alumina system Park, YB; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.109 - 114, 1999-06 |
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