Showing results 1001 to 1020 of 19424
Additive manufacturing of titanium-base alloys with equiaxed microstructures using powder blends Choi, Gwanghyo; Choi, Won Seok; Han, Jeongho; Choi, Pyuck-Pa, ADDITIVE MANUFACTURING, v.36, pp.101467, 2020-12 |
Additive Soft-Lithographic Patterning of Submicrometer- and Nanometer-Scale Large-Area Resists on Electronic Materials Ahn, Heejoon; Lee, Keonjae; Shim, Anne; Rogers, John A; Nuzzo, Ralph G., NANO LETTERS, v.5, no.12, pp.2533 - 2537, 2005-10 |
Adhesion and Diffusion Barrier Properties of Ta Films Fabricated by Auxiliary Plasma Assisted Bias Sputtering Kim, Yong-Chul; Lee, Do-Seon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.49, no.7, 2010-07 |
Adhesion and Diffusion Barrier Properties of Ta Films Fabricated by Auxiliary Plasma Assisted Bias Sputtering Kim, Yong-Chul; Lee, Do-Seon; Lee, Won-Jong, Japanese Journal of Applied Physics, Vol.49, 2010-07-20 |
Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07 |
Adhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish Kim, HJ; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1707 - 1713, IEEE, 2007-05-29 |
Adhesion and wear properties of TiN films deposited on martensitic stainless steel and Stellite by reactive magnetron sputter ion plating Lee, MK; Kim, WW; Kim, JS; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.254, no.1, pp.42 - 48, 1998-03 |
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
Adhesion behaviours of hepatocytes cultured onto biodegradable polymer surface modified by alkali hydrolysis process Nam, YoonSung; Yoon, JJ; Lee, JG; Park, TG, JOURNAL OF BIOMATERIALS SCIENCE-POLYMER EDITION, v.10, no.11, pp.1145 - 1158, 1999 |
ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.2, no.1, pp.245 - 253, 1988 |
ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.4, no.1, pp.465 - 474, 1990 |
ADHESION MECHANISMS OF THICK-FILM CONDUCTORS Kim, Ho Gi; ROTHLINGSHOFER, W; TOMANDL, G, SOLID STATE TECHNOLOGY, v.22, no.3, pp.62 - 66, 1979 |
Adhesion reliability of Cu-Cr alloy films to polyimide Ahn, EC; Yu, Jin; Oh, TC; Park, IS, Proceedings of the 1996 MRS Spring Symposium, pp.67 - 71, MRS, 1996-04-08 |
Adhesion strength of CuCr alloy films to polyimide Ahn, EC; Yu, Jin; Park, IS, Spring Meeting on MRS, v.390, pp.55 - 60, 1995-04-17 |
Adhesion strength of leadframe/EMC interfaces Lee, HY; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447, 1999-12 |
Adhesion study of copper and chromium films to polyimide Chung, TG; Yu, Jin; Kim, YH; Ahn, EC; Park, IS, Proceedings of the Fall 1993 MRS Meeting, v.323, pp.377 - 382, 1993-11-29 |
Adsorbent for carbon dioxide and manufacturing method for the same Kim, Sang Ouk; Oh, Young Tak, 2019-06-25 |
Adsorption of Hydrogen on Carbon Nanotubes and Boron Nitride Nanotubes Lee, Hyuck-Mo, 4th 21st Century COE International Symposium on Towards Creating New Industries Based on Inter-Nanoscience, OSAKA UNIVERSITY, 2005-11 |
Adsorption of Hydrogen on Carbon Nanotubes and Boron Nitride Nanotubes: Quantum and Atomistic Simulation Lee, Hyuck Mo, the 4th 21st Century COE International Symposium on Towards Creating New Industries Based on Inter-Nanoscience, pp.23 - 27, 2005-11-18 |
Adsorption of the Pt and Pd atoms on c-ZrO2 and c-Zr0.75Ce0.25O2 Lee, Hyuck Mo, 제7회 고등과학원 전자구조 계산학회, 2011-06-23 |
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