Moire interferometry is a useful technique to assess the reliability of electronic package because Moire interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of Moire interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the Moire technique. AFM Moire technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM Moire is proposed. A phase-shifting method is applied to improve the resolution of AFM Moire.