Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jung, Daniel H | ko |
| dc.contributor.author | Kim, Joohee | ko |
| dc.contributor.author | Kim, Heegon | ko |
| dc.contributor.author | Kim, Jonghoon J | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Pak, Jun So | ko |
| dc.date.accessioned | 2013-03-29T18:50:55Z | - |
| dc.date.available | 2013-03-29T18:50:55Z | - |
| dc.date.created | 2012-12-03 | - |
| dc.date.created | 2012-12-03 | - |
| dc.date.created | 2012-12-03 | - |
| dc.date.issued | 2012-10-23 | - |
| dc.identifier.citation | Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.uri | http://hdl.handle.net/10203/172965 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000323212000075 | - |
| dc.identifier.scopusid | 2-s2.0-84874463571 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Tempe, AZ | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Jung, Daniel H | - |
| dc.contributor.nonIdAuthor | Kim, Joohee | - |
| dc.contributor.nonIdAuthor | Kim, Heegon | - |
| dc.contributor.nonIdAuthor | Kim, Jonghoon J | - |
| dc.contributor.nonIdAuthor | Pak, Jun So | - |
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