DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | - |
dc.contributor.author | Cho, J. | - |
dc.contributor.author | Kim, J. | - |
dc.date.accessioned | 2013-03-28T11:37:59Z | - |
dc.date.available | 2013-03-28T11:37:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-09-13 | - |
dc.identifier.citation | 3rd Electronics System Integration Technology Conference, ESTC 2010, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/165367 | - |
dc.language | ENG | - |
dc.publisher | ESTC 2010 | - |
dc.title | TSV modeling and noise coupling in 3D IC | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-78651327147 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 3rd Electronics System Integration Technology Conference, ESTC 2010 | - |
dc.identifier.conferencecountry | Germany | - |
dc.identifier.conferencecountry | Germany | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Cho, J. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.