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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

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Choi, Y / Shin, J / Paik, Kyung-Wookresearcher
Publisher
ECTC
Issue Date
2011-05-31
Language
English
Citation

2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1126 - 1129

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164607
Appears in Collection
MS-Conference Papers(학술회의논문)
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