DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, K | ko |
dc.contributor.author | Kim, HJ | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2013-03-27T00:57:44Z | - |
dc.date.available | 2013-03-27T00:57:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-11-19 | - |
dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 | - |
dc.identifier.uri | http://hdl.handle.net/10203/157662 | - |
dc.language | English | - |
dc.publisher | 123 | - |
dc.title | Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications | - |
dc.type | Conference | - |
dc.identifier.wosid | 000259300000041 | - |
dc.identifier.scopusid | 2-s2.0-51249090741 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 0 | - |
dc.citation.endingpage | 0 | - |
dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Daejeon | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, K | - |
dc.contributor.nonIdAuthor | Kim, HJ | - |
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