Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications

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dc.contributor.authorLee, Kko
dc.contributor.authorKim, HJko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2013-03-27T00:57:44Z-
dc.date.available2013-03-27T00:57:44Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-11-19-
dc.identifier.citationInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0-
dc.identifier.urihttp://hdl.handle.net/10203/157662-
dc.languageEnglish-
dc.publisher123-
dc.titleRoom temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications-
dc.typeConference-
dc.identifier.wosid000259300000041-
dc.identifier.scopusid2-s2.0-51249090741-
dc.type.rimsCONF-
dc.citation.beginningpage0-
dc.citation.endingpage0-
dc.citation.publicationnameInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationDaejeon-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorLee, K-
dc.contributor.nonIdAuthorKim, HJ-
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MS-Conference Papers(학술회의논문)
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