DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, E. | - |
dc.contributor.author | Shin, Youngsoo | - |
dc.date.accessioned | 2013-03-19T00:23:55Z | - |
dc.date.available | 2013-03-19T00:23:55Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-18 | - |
dc.identifier.citation | 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008, v., no., pp.2765 - 2768 | - |
dc.identifier.issn | 0271-4310 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154010 | - |
dc.language | ENG | - |
dc.title | 3-D thermal simulation with dynamic power profiles | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51749092395 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 2765 | - |
dc.citation.endingpage | 2768 | - |
dc.citation.publicationname | 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Shin, Youngsoo | - |
dc.contributor.nonIdAuthor | Choi, E. | - |
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