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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method

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dc.contributor.authorSon, HY-
dc.contributor.authorGam, SA-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-18T17:39:10Z-
dc.date.available2013-03-18T17:39:10Z-
dc.date.created2012-02-06-
dc.date.issued2004-12-
dc.identifier.citationFormation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method, v., no., pp.147 - 152-
dc.identifier.urihttp://hdl.handle.net/10203/150817-
dc.languageENG-
dc.titleFormation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage147-
dc.citation.endingpage152-
dc.citation.publicationnameFormation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method-
dc.identifier.conferencecountryMalaysia-
dc.identifier.conferencecountryMalaysia-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorGam, SA-
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MS-Conference Papers(학술회의논문)
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