Au wire와 AI pad간의 계면 반응과 접합신뢰성에 있어서의 첨가원소 Pd과 Cu의 영향Effects of Pd and Cu addition on Au bonding wire/AI pads interfacial reactions and bond reliability
- Issue Date
- 2005
- Language
- KOR
- Citation
한국 마이크로 전자 및 패키징 학회 (IMASPS-Korea) 2005년도 추계기술심포지움, pp.196 - 201
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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