Optimization of low temperature flip-chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems
- Issue Date
- 2003
- Language
- ENG
- Citation
Microoptics Conference, pp.402 - 405
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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