Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Issue Date
- 2003-05-27
- Language
- ENG
- Citation
53rd Electronic Components and Technology Conference 2003, pp.1190 - 1196
- ISSN
- 0569-5503
- Appears in Collection
- NE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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