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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load

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Kim, I / Lee, Soon-Bokresearcher
Issue Date
2005
Language
ENG
Citation

IEEE Transactions on Components and Packaging Technologies, pp.478 - 484

ISSN
1521-3331
URI
http://hdl.handle.net/10203/143446
Appears in Collection
ME-Conference Papers(학술회의논문)
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