DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hong, Soon-Hyung | - |
dc.contributor.author | Kim, YM | - |
dc.contributor.author | Kim, KS | - |
dc.contributor.author | Hahn, JH | - |
dc.contributor.author | Lee, CS | - |
dc.contributor.author | Park, JH | - |
dc.date.accessioned | 2013-03-17T05:32:30Z | - |
dc.date.available | 2013-03-17T05:32:30Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003 | - |
dc.identifier.citation | International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/140260 | - |
dc.language | ENG | - |
dc.title | Characterization of Young's Modulus of Electroplated Cu Films using Nanoindentation Techniques | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.contributor.localauthor | Hong, Soon-Hyung | - |
dc.contributor.nonIdAuthor | Kim, YM | - |
dc.contributor.nonIdAuthor | Kim, KS | - |
dc.contributor.nonIdAuthor | Hahn, JH | - |
dc.contributor.nonIdAuthor | Lee, CS | - |
dc.contributor.nonIdAuthor | Park, JH | - |
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