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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Via filling for system in packaging by using ionized metal plasma PVD and electroplating

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Lee, Won-Jongresearcher / Cho, Byung Hoon
Issue Date
2004
Language
ENG
Citation

Kyoto Joint Symposium on Materials Science and Engineering for the 21st Century, pp.88 - 88

URI
http://hdl.handle.net/10203/140169
Appears in Collection
MS-Conference Papers(학술회의논문)
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