DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | - |
dc.contributor.author | Kim, Tae Hong | - |
dc.contributor.author | Lee, Junho | - |
dc.contributor.author | Kim, Hyungsoo | - |
dc.date.accessioned | 2013-03-16T21:53:47Z | - |
dc.date.available | 2013-03-16T21:53:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002 | - |
dc.identifier.citation | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, v., no., pp.217 - 220 | - |
dc.identifier.uri | http://hdl.handle.net/10203/136288 | - |
dc.language | ENG | - |
dc.publisher | IEEE | - |
dc.title | 3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 217 | - |
dc.citation.endingpage | 220 | - |
dc.citation.publicationname | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Tae Hong | - |
dc.contributor.nonIdAuthor | Lee, Junho | - |
dc.contributor.nonIdAuthor | Kim, Hyungsoo | - |
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