T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test)
- Issue Date
- 2000
- Language
- KOR
- Citation
IMAPS Korea 2000 , Fall Symp. Dankuk Uni pp.107 - 111
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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