DSpace at KOASAS: Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구

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Publisher: The Microelectronics and Packaging Society

Issue Date: 2001-07-01

Language: KOR

Citation: The Microelectronics and Packaging Society, IMAPS-Korea Workshop 2001, pp.95 - 99

URI: http://hdl.handle.net/10203/131962

Appears in Collection: MS-Conference Papers(학술회의논문)

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Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구

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