Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Conference
Showing results 8781 to 8800 of 15771
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
| Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods Lee, Soon-Bok; Ham, SJ, Workshop on Flip Chip Packaging, 1999 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads Kim, IH; Lee, Soon-Bok, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.64 - 71, 2006 |
| Reliability based design optimization for crashworthiness of a spot welded hat type member Kim, Yu Jong; Huh, Hoon, 8th World Congress on Structural and Multidisciplinary Optimization, WCSMO8, 2009-06-01 |
| Reliability based design optimization using the response surface augmented moment method Kwak, Byung Man, World Congress on Structural and Multidisciplinary Optimization, pp.102 -, 2005 |
| Reliability Based Optimal Design Using POD Technique KWAK BYUNG MAN, pp.66 - 79, 1987-05-01 |
| Reliability based robust design of a vibratory micro gyroscope Kwak, Byung Man, pp.162 - 163, 2001-06-01 |
| Reliability Based Structural Optimal Design Considering Non-normal Distributions of Fatigue Strength KWAK BYUNG MAN, pp.0 - 0, 1992-05-01 |
| Reliability Based Topology Optimization of Rubber Engine Mount Lee, Wan-Sul; Youn, Sung-Kie, the 13th International Pacific Conference on Automotive Engineering, pp.0 - 0, 2005-08 |
| Reliability estimation of reduced-order models Kim, Jin-Gyun; Lee, Phill-Seung, 한국소음진동공학회 2014년 춘계학술대회, 한국소음진동공학회, 2014-04-25 |
| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 |
| Reliability Improvement of Experimental Setup with Transparent Windows Visualizing the Two-phase Flow in PEMFC Lee Dongryul; Bae Joongmyeon, FUCE 2010 (Fuel Cells Science and Technology 2010), Elsevier, 2010-10-06 |
| Reliability-Based Design for Market Systems (RBDMS): Case Study on Electric Vehicle Design Lee, woongki; Lee, Ikjin; Kang, Namwoo, AOTULE 2017, HANOI UNIVERSITY OF SCIENCE AND TECHNOLOGY (HUST), 2017-11-22 |
| Reliability-based design of pile-guided floater for an offshore LNG bunkering terminal Lee, Seong-yeob; Chang, Daejun, The 4th U.Tokyo-SJTU-KAIST Joint Academic Symposium, KAIST, 2017-09-04 |
| Reliability-based Design Optimization (RBDO) for Electric Vehicle Market Systems 이익진; 강남우; 이웅기, 2017년도 대한기계학회 춘계학술대회 CAE 및 응용역학부문, 대한기계학회, 2017-05-25 |
| RELIABILITY-BASED DESIGN OPTIMIZATION (RBDO) FOR ELECTRIC VEHICLE MARKET SYSTEMS Lee, Woongki; Kang, Namwoo; Lee, Ikjin, ASME International Design Engineering Technical Conferences / Computers and Information in Engineering Conference (IDETC/CIE 2017), THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, 2017-08-06 |
| Reliability-Based Design Optimization of Highway Horizontal Curves Based on first-Order Reliability Method Lee, IkJin; Shin, J, WCSMO10, WCSMO, 2013-05-22 |
| Reliability-based Design Optimization of Thermoelectric Generator System Fin Structures using Space Mapping 박정우; 이익진, 2022년도 전산구조공학회 정기학술대회, 전산구조공학회, 2022-04-14 |
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