Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Conference
Showing results 6841 to 6860 of 15771
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, JSME-CMD International Computational Mechanics Symposium, JSME-CMD, 2012-10-11 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 14th International Conference on Modern Materials and Technologies, The National Research Council of Italy, 2018-06-10 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 대한금속재료학회 2015년 춘계학술대회, 대한금속재료학회, 2015-04-23 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), International Conference on Electronic Packaging, 2015-04-16 |
| Mechanical Reliability of Advanced Thin Films 김택수, 2013 the Korean Microelectronics and Packaging Society Meeting, Korean Microelectronics and Packaging Society, 2013-11-14 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Mechanical Reliability of Advanced Thin Films for Flexible Devices Kim, Taek Soo, 2016 International Conference on Electronics Packaging, International Conference on Electronics Packaging, 2016-04-22 |
| Mechanical Reliability of Cu/Low-k Interconnects and Underfill Yoon, Taeshik; Lee, Inhwa; Kim, Taek-Soo, IEEE International 3D System Integration Conference, IEEE, 2012-02-02 |
| Mechanical Reliability of Electronics Packaging Lee, Soon-Bok; Ham, SJ, pp.3 - 45, 2001 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, Korea-SV Electronics Packaging Technology Workshop, Korea-SV Electronics Packaging Technology Workshop, 2010-10-21 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, The 10th International Symposium on Microelectronics and Packaging, Korean Microelectronics and Packaging Society, 2011-10-12 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill 김택수, MPC2011 Autumn Symposium, MPC, 2011-10-14 |
| Mechanical sensor for the clearance depth control of a non-explosive demining system Kwak, Yoon Keun, 1st International Conference on Sensing Technology(ICST 2005), pp.678 - 682, ICST, 2005-11-01 |
| Mechanical stimulation induce fibroblast maturation and skin regeneration Ko, Ung Hyun; Choi, Jong-Jin; Choung, Jin Seung; Han, Je-Hyun; Moon, Sung-Hwan; Shin, Jennifer Hyunjong, 대한생체역학회 2016 추계학술대회, 대한생체역학회, 2016-09 |
| Mechanical Testing of Metallic Thin Films at Elevated Temperatures Sim, Gi-Dong, 5th International Conference on Materials and Reliability, The Korean Society of Mechanical Engineers(KSME), 2019-11-29 |
| Mechanical-arm navigation system for acetabular cup orientation Kim, W.S; Ko, B.H; Kim, Y.Y.; Yoon, Yong-San, Computer Assisted Orthopaedic Surgery, 2006-06 |
| Mechanical/Electrical Behavior of Patterned Metal Nanoparticle-based Thin Film and Flexible Pressure Sensor Applications Park, Inkyu; Lee, JH; Yang, D; Kim, S, 2012 MRS Fall Metting, MRS, 2012-11 |
| Mechanically Reliable Mechanism using Torsion Spring and Compliant Adhesive for Rollable Display Ma, Boo Soo; Kim, Taek-Soo, The 16th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2017-10-19 |
| Mechanically steerable microphone array for sound source identification Park, Youngjin; Kim, D, HCI2002, pp.0 - 0, 2002 |
| Mechanically Strengthened Electroadhesion based Soft Gripper with Multi-layered Dielectric Elastomer Actuator Hwang, Geonwoo; Park, Jihwan; Cortes, David Santiago Diaz; Kyung, Ki-Uk, 3rd IEEE International Conference on Soft Robotics, RoboSoft 2020, pp.748 - 753, Institute of Electrical and Electronics Engineers Inc., 2020-05-15 |
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