Showing results 9321 to 9340 of 12472
THERMALLY INDUCED FLOW OSCILLATION IN VERTICAL 2-PHASE NATURAL CIRCULATION LOOP Lee, Sang Yong; ISHII, M, NUCLEAR ENGINEERING AND DESIGN, v.122, no.1-3, pp.119 - 132, 1990-09 |
Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
Thermally-forced stratification build-up in an initially isothermal, contained fluid Hyun, Jae Min, JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, v.54, no.3, pp.942 - 949, 1985-03 |
Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor Lee, Byeongju; Cho, Incheol; Kang, Mingu; Yang, Daejong; Park, Inkyu, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.33, no.8, 2023-08 |
Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires Lee, Won Seok; Won, Sejeong; Park, Jeunghee; Lee, Jihye; Park, Inkyu, NANOSCALE, v.4, no.11, pp.3444 - 3449, 2012-03 |
Thermo-elasto-plastic finite element analysis of quenching process of carbon steel Kang, SH; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.192-193, no.SI, pp.381 - 390, 2007-08 |
Thermo-elastohydrodynamic analysis of connecting rod bearing in internal combustion engine Kim B.-J.; Kim, Kyung-Woong, JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, v.123, no.3, pp.444 - 454, 2001-07 |
Thermo-hydraulic analysis of the KSTAR central solenoid model coil Chung, WH; Park, S; Wang, QL; Jeong, Sangkwon; Yoon, CS; Oh, YK; Kim, K; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.15, no.2, pp.1411 - 1414, 2005-06 |
Thermo-mechanical response of single-phase face-centered-cubic AlxCoCrFeNi high-entropy alloy microcrystals Jiao, Quan; Sim, Gi-Dong; Komarasamy, Mageshwari; Mishra, Rajiv S.; Liaw, Peter K.; El-Awady, Jaafar A., MATERIALS RESEARCH LETTERS, v.6, no.5, pp.300 - 306, 2018-03 |
Thermodynamic analysis of molten salt-based single-tank thermal energy storage system with heat transfer enhanced by gas injection Che, Sanghyun; Kim, Juwon; Jeon, Jaeheon; Chang, Daejun, JOURNAL OF ENERGY STORAGE, v.77, 2024-01 |
Thermodynamic and kinetic hydrate inhibition performance of aqueous ethylene glycol solutions for natural gas Cha, Min-Jun; Shin, Kyu-Chul; Kim, June-Young; Chang, Daejun; Seo, Yu-Taek; Lee, Huen; Kang, Seong-Pil, CHEMICAL ENGINEERING SCIENCE, v.99, pp.184 - 190, 2013-08 |
Thermodynamic inhibition of 4-methylmorpholine while forming sH hydrate with methane Park, Seongmin; Kang, Hyery; Lim, Dongwook; Lee, Jong-Won; Seo, Yutaek; Lee, Huen, CHEMICAL ENGINEERING SCIENCE, v.138, pp.347 - 352, 2015-12 |
Thermodynamic performance comparison of a two-stage cryocooler and cascade cryocoolers with thermal anchoring for precooling purpose Jeong, Sangkwon; Jin, Lingxue, CRYOGENICS, v.99, pp.32 - 38, 2019-04 |
Thermoelastic analysis of circular arc-shaped cracks Chung, HD; Beom, HG; Choi, SY; Earmme, Youn-Young, JOURNAL OF THERMAL STRESSES, v.21, no.2, pp.129 - 140, 1998-03 |
Thermoelastic interaction between a crack and a circular inhomogeneity Chung, DY; Huh, MS; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.111, no.1, pp.L9 - L14, 2001-09 |
Thermoelectric Sensor with CuI Supported on Rough Glass Panama, Gustavo; Lee, Seung-Seob, NANOMATERIALS, v.14, no.1, 2024-01 |
Thermomechanical analyses of laser precision joining for optoelectronic components Chang, WS; Na, Suck-Joo, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.2, pp.349 - 358, 2003-06 |
Thermomechanical Behavior of Poly(3-hexylthiophene) Thin Films on the Water Surface Ma, Boo Soo; Lee, Jin-Woo; Park, Hyeonjung; Kim, Bumjoon J.; Kim, Taek-Soo, ACS OMEGA, v.7, no.23, pp.19706 - 19713, 2022-06 |
Thermomechanical fatigue behavior of the ferritic stainless steel Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005 |
Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
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