Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Article
Showing results 9261 to 9280 of 12465
| Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum Lee, Eung Chang; Rho, Jinsung; Kang, Heeyoub; Lee, Bong Jae, IEEE ELECTRON DEVICE LETTERS, v.39, no.12, pp.1908 - 1911, 2018-12 |
| Thermal analysis on the letter mark spot of the corvette Cheonan-hit torpedo Song, Tae-Ho, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.25, no.4, pp.937 - 943, 2011-04 |
| Thermal anchoring of conduction-cooled current leads for superconductivity applications near liquid nitrogen temperature Jeong, Sang-Kwon; Kim, Young-Kwon, CRYOGENICS, v.50, no.4, pp.287 - 291, 2010-04 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films 이인화; 김택수, 마이크로전자 및 패키징학회지, v.21, no.1, pp.41 - 44, 2014-03 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi, S, COMPOSITE STRUCTURES, v.47, no.1-4, pp.695 - 703, 1999-12 |
| Thermal buckling of laminated composite beams with embedded shape memory alloy actuators Choi, S; Lee, Jungju; Lee, DC, JOURNAL OF COMPOSITE MATERIALS, v.34, no.18, pp.1529 - 1547, 2000 |
| Thermal Characteristic Modeling and Compensation for the Improvement of Actuator Homeostasis Youn, Jimin; Kim, hyeongjun; Shi, Kyeongsu; Kong, Kyoungchul, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.29, no.4, pp.3019 - 3027, 2024-08 |
| Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
| Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
| Thermal characteristics of the spindle bearing system with a gear located on the bearing span Choi, JK; Lee, Dai Gil, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.38, no.9, pp.1017 - 1030, 1998-09 |
| Thermal characteristics of tubular single lap adhesive joints under axial loads Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.15, no.12, pp.1511 - 1528, 2001 |
| Thermal characterization and optimization of pulsating heat pipes operating in a circulation mode Noh, Hyung Yun; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.115, pp.1234 - 1246, 2017-12 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
| Thermal Conductance of Multiple Vacuum/Plate Layer Il Seob Yoon; Song, Tae-Ho, THERMAL SCIENCE AND ENGINEERING, v.13, no.2, pp.29 - 32, 2005 |
| Thermal conduction from microcantilever heaters in partial vacuum Lee, Jungchul; Wright, Tanya L.; Abel, Mark R.; Sunden, Erik O.; Marchenkov, Alexei; Graham, Samuel; King, William P., JOURNAL OF APPLIED PHYSICS, v.101, no.1, 2007-01 |
| Thermal control of electroosmotic flow in a microchannel through temperature-dependent properties Kwak, Ho Sang; Kim, Hyoungsoo; Hyun, Jae Min; Song, Tae-Ho, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.335, no.1, pp.123 - 129, 2009-07 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
| Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01 |
| Thermal design of a combined hydrogen and oxygen supply system for a fuel cell in low-oxygen environments Kim, Dong-min; Choi, Sinwoo; Cheon, Hyungjun; Roh, Heesook; Bae, Joongmyeon; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.50, no.Part D, pp.1317 - 1325, 2024-01 |
| Thermal design of a hydrogen storage system using La(Ce)Ni-5 Kim, Joong Bae; Han, Gwangwoo; Kwon, YongKeun; Bae, Joongmyeon; Cho, EunAe; Cho, SungBaek; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.45, no.15, pp.8742 - 8749, 2020-03 |
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