Showing results 9121 to 9140 of 12228
Thermopiezoelastic snapping of piezolaminated plates using layerwise nonlinear finite elements Oh, Il-Kwon; Han, Jae-Hung; Lee, In, AIAA JOURNAL, v.39, no.6, pp.1188 - 1197, 2001-06 |
Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
THERMOVISCOPLASTIC ANALYSIS OF HYPERSONIC STRUCTURES SUBJECTED TO SEVERE AERODYNAMIC HEATING Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, JOURNAL OF AIRCRAFT, v.27, no.9, pp.826 - 835, 1990-09 |
Thickness minimized magnetic circuit for rotary-type voice coil motor Jeong, JH; Lee, JH; Yoon, HK; Gweon, Dae-Gab, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.44, no.3, pp.1262 - 1263, 2005-03 |
Thickness-profile measurement of transparent thin-film layers by white-light scanning interferometry Kim, Seung-Woo; Kim, GH, APPLIED OPTICS, v.38, no.28, pp.5968 - 5973, 1999-10 |
Thin film display based on polymer waveguides Park, Suntak; Park, Bong Je; Yun, Sungryul; Nam, Saekwang; Park, Seung Koo; Kyung, Ki-Uk, OPTICS EXPRESS, v.22, no.19, pp.23433 - 23438, 2014-09 |
Thin-film thickness profile and its refractive index measurements by dispersive white-light interferometry Ghim, Young-Sik; Kim, Seung-Woo, OPTICS EXPRESS, v.14, no.24, pp.11885 - 11891, 2006-11 |
Three Degrees of Freedom Active Control of Pneumatic Vibration Isolation Table by Pneumatic and Time Delay Control Technique Shin, YH; Kim, Kwang-joon; Chang, PH; Han, DK, JOURNAL OF VIBRATION AND ACOUSTICS-TRANSACTIONS OF THE ASME, v.132, no.5, 2010-10 |
Three dimensional analysis of high frequency induction welding of steel pipes with impeder Kim, HJ; Youn, Sung-Kie, JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, v.130, no.3, 2008-06 |
Three dimensional elements with Lagrange multipliers for the modified couple stress theory Kwon, Young Rok; Lee, Byung-Chai, COMPUTATIONAL MECHANICS, v.62, no.1, pp.97 - 110, 2018-07 |
Three dimensional multi-step inverse analysis for the optimum blank design in sheet metal forming processes Lee, CH; Huh, Hoon, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.80-1, pp.76 - 82, 1998 |
Three Dimensional Upper Limb Joint Kinetics of a Golf Swing with Measured Internal Grip Force Choi, Hyeob; Park, Sukyung, SENSORS, v.20, no.13, 2020-07 |
Three Way Relationship of Human-Robot Interaction Hwang, Jung-Hoon; Lee, KangWoo; Kwon, Dong-Soo, LECTURE NOTES IN COMPUTER SCIENCE, v.4552, pp.321 - 330, 2007-07 |
Three-axis lever actuator with flexure hinges for an optical disk system Han, CS; Kim, Soohyun, REVIEW OF SCIENTIFIC INSTRUMENTS, v.73, no.10, pp.3678 - 3686, 2002-10 |
Three-Degrees-of-Freedom Passive Gravity Compensation Mechanism Applicable to Robotic Arm With Remote Center of Motion for Minimally Invasive Surgery Kim, Chang-Kyun; Chung, Deok Gyoon; Hwang, Minho; Cheon, Byungsik; Kim, Hansoul; Kim, Joonhwan; Kwon, Dong-Soo, IEEE Robotics and Automation Letters, v.4, no.4, pp.3473 - 3480, 2019-10 |
Three-Dimensional Analysis of Molten Pool in GMA-Laser Hybrid Welding Cho, JH; Na, Suck-Joo, WELDING JOURNAL, v.88, no.2, pp.35S - 43S, 2009-02 |
Three-dimensional bulk metal forming simulations under a PC cluster environment Cheon, JS; Kim, SY; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.140Special, no.SI, pp.36 - 42, 2003-09 |
Three-dimensional coherent structure in a separated and reattaching flow over a backward-facing step Lee, I; Ahn, SK; Sung, Hyung Jin, EXPERIMENTS IN FLUIDS, v.36, pp.373 - 383, 2004-03 |
Discover