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Showing results 1 to 4 of 4

1
Diagnosis criterion for damage monitoring of adhesive joints by a piezoelectric method

Hwang, HY; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1053 - 1080, 2005

2
Piezoelectric monitoring of the reliability of adhesive joints

Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.6, pp.777 - 796, 2003

3
Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method

Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005

4
Temperature effects on the torsional fatigue characteristics of adhesively bonded tubular single-lap joints

Hwang, HY; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.4, pp.413 - 425, 2004

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