Showing results 2 to 2 of 2
Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005 |
Discover