Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject MOLECULAR-DYNAMICS

Showing results 14 to 23 of 23

14
High tensile strength of sputter-deposited ZrB2 ceramic thin films measured up to 1016 K

Sim, Gi-Dong; Choi, Yong Seok; Lee, Dongwoo; Oh, Kyu Hwan; Vlassak, Joost J., ACTA MATERIALIA, v.113, pp.32 - 40, 2016-07

15
Improved modified embedded-atom method potentials for gold and silicon

Ryu, Seunghwa; Weinberger, Christopher R.; Baskes, Michael I.; Cai, Wei, MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, v.17, no.7, 2009-10

16
Interfacial properties of liquid metal immersed in various liquids

Ryu, Gaabhin; Park, Kwangseok; Kim, Hyoungsoo, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.621, pp.285 - 294, 2022-09

17
Mechanical Failure Mode of Metal Nanowires: Global Deformation versus Local Deformation

Duc Tam Ho; Im, Youngtae; Kwon, Soon-Yong; Earmme, Youn Young; Kim, Sung Youb, SCIENTIFIC REPORTS, v.5, 2015-06

18
Mechanical strength characteristics of asymmetric tilt grain boundaries in graphene

Han, Jihoon; Ryu, Seunghwa; Sohn, Dongwoo; Im, Seyoung, CARBON, v.68, pp.250 - 257, 2014-03

19
Mobility of a 5 vertical bar 7 defect in carbon nanotubes

Lee, Youngmin; Han, Jihoon; Lee, In-Ho; Im, Seyoung, NANOTECHNOLOGY, v.22, no.10, 2011-03

20
Nanoindentation cannot accurately predict the tensile strength of graphene or other 2D materials

Han, Jihoon; Pugno, Nicola M.; Ryu, Seunghwa, NANOSCALE, v.7, no.38, pp.15672 - 15679, 2015-08

21
Predicting the dislocation nucleation rate as a function of temperature and stress

Ryu, Seunghwa; Kang, Keonwook; Cai, Wei, JOURNAL OF MATERIALS RESEARCH, v.26, no.18, pp.2335 - 2354, 2011-09

22
Stacking fault energy-dependent plastic deformation of face-centered-cubic metal nanowires under torsional loading

Lee, Sangryun; Ryu, Ill; Ryu, Seunghwa, EXTREME MECHANICS LETTERS, v.40, 2020-10

23
Toward Modular Analysis of Supramolecular Protein Assemblies

Kim, Jaehoon; Kim, Jin-Gyun; Yun, Giseok; Lee, Phill-Seung; Kim, Do-Nyun, JOURNAL OF CHEMICAL THEORY AND COMPUTATION, v.11, no.9, pp.4260 - 4272, 2015-09

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