Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject DEFORMATION
Showing results 122 to 124 of 124
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Yield and strain rate potentials for aluminum alloy sheet forming design Chung, Kwansoo; Barlat, Frédéric; Yoon, Jeong Whan; Richmond, Owen; Brem, John C; Lege, Daniel J, METALS AND MATERIALS INTERNATIONAL, v.4, no.4, pp.931 - 938, 1998 |
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