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Showing results 1 to 7 of 7

1
A study on the thermomechanical behavior of semiconductor chips on thin silicon substrate

Lim, Jae Hyuk; Han, ManHee; Lee, Jun-Youn; Earmme, Youn Young; Lee, Soon-Bok; Im, Seyoung, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.22, no.8, pp.1483 - 1489, 2008-08

2
Finite element analysis of the wrinkling initiation and growth in modified Yoshida buckling test

Kim, JB; Yang, Dong-Yol, METALS AND MATERIALS-KOREA, v.4, no.4, pp.640 - 647, 1998

3
Finite element analysis of wrinkling membr large deformations

Lee, ES; Youn, Sung-Kie, FINITE ELEMENTS IN ANALYSIS AND DESIGN, v.42, no.8-9, pp.780 - 791, 2006-05

4
Investigation into the wrinkling behaviour of thin sheets in the cylindrical cup deep drawing process using bifurcation theory

Kim, JB; Yoon, Jeong Whan; Yang, Dong-Yol, INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, v.56, no.12, pp.1673 - 1705, 2003-03

5
Investigation into wrinkling behavior in the elliptical cup deep drawing process by finite element analysis using bifurcation theory

Kim, JB; Yoon, Jeong Whan; Yang, Dong-Yol; Barlat, F, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.111, no.1-3, pp.170 - 174, 2001-04

6
Wrinkling during Cup Drawing with NUMISHEET2014 Benchmark Test

Dick, Robert E.; Yoon, Jeong Whan, STEEL RESEARCH INTERNATIONAL, v.86, no.8, pp.915 - 921, 2015-08

7
Wrinkling initiation and growth in modified Yoshida buckling test: Finite element analysis and experimental comparison

Kim, JB; Yoon, Jeong Whan; Yang, Dong-Yol, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.42, no.9, pp.1683 - 1714, 2000-09

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