Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectwafer-level

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1
Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die

Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Donresearcher; Lee, Seung-Seobresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06

2
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink

조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001

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