Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectwafer level

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Novel Sidewall Interconnection Using a Perpendicular Circuit Die for 3-D Chip Stacking

Kim, Sun-Rak; Lee, Jae Hak; Lee, Seung-Seobresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1265 - 1272, 2015-09

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