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Methodology development of packaging substrate warpage analysis = 패키징 기판의 휨 분석 방법 개발link Kim, Cheol-Gyu; 김철규; et al, 한국과학기술원, 2014 |
Reliable joining of the spring wire to polymer composite for the micro-multi-functional actuator of cellular phones Kim, HS; Park, SW; Lee, Dai Gil, COMPOSITE STRUCTURES, v.76, no.3, pp.252 - 259, 2006-11 |
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