Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject moisture
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| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
| 모아레를 이용한 고온-고습 환경에서 플립 칩 전자 패키지의 신뢰성 평가 = Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using Moirelink 박진형; Park, Jin-Hyoung; et al, 한국과학기술원, 2009 |
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