Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectdegree of cure

Showing results 1 to 7 of 7

Dielectric cure monitoring for glass/polyester prepreg composites

Kim, HG; Lee, Dai Gilresearcher, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07

Measurement of the degree of cure of carbon fiber epoxy composite materials

Kim, JS; Lee, Dai Gilresearcher, JOURNAL OF COMPOSITE MATERIALS, v.30, no.13, pp.1436 - 1457, 1996

Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry

Bang, KG; Kwon, JW; Lee, Dai Gilresearcher; Lee, JW, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.113, no.1-3, pp.209 - 214, 2001-06

Non-isothermal in situ dielectric cure monitoring for thermosetting matrix composites

Lee, Dai Gilresearcher; Kim, HG, JOURNAL OF COMPOSITE MATERIALS, v.38, no.12, pp.977 - 993, 2004

Reduction of residual stresses in thick-walled composite cylinders by smart cure cycle with cooling and reheating

Kim, JW; Lee, JH; Kim, HG; Kim, HS; Lee, Dai Gilresearcher, COMPOSITE STRUCTURES, v.75, no.1-4, pp.261 - 266, 2006-09

Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications

Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jinresearcher; Paik, Kyung-Wookresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10

열경화성 수지 복합재료의 유전 경화 모니터링

김형근; 이대길researcher, 비파괴검사학회지, v.23, no.5, pp.409 - 417, 2003-10



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