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Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics 김산위; 김택수, 마이크로전자 및 패키징학회지, v.19, no.3, pp.63 - 69, 2012-09 |
Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films 이인화; 김택수, 마이크로전자 및 패키징학회지, v.21, no.1, pp.41 - 44, 2014-03 |
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