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Showing results 1 to 4 of 4

1
Compact modeling of fluid flow and heat transfer in straight fin heat sinks

Kim, D; Kim, SungJin, JOURNAL OF ELECTRONIC PACKAGING, v.126, no.2, pp.247 - 255, 2004-06

2
Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip

Shin, DongKil; Lee, Jung-Ju; Yoon, ChulKeun; Lee, GyuJei; Hong, JoonKi; Kim, NamSuk, ENGINEERING FRACTURE MECHANICS, v.133, pp.179 - 190, 2015-01

3
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07

4
Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film

Kim, Kyung-Soo; Ha, CW; Jang, TY; Joung, SW; Yun, WS, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10, 2010-10

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