Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject MOLD

Showing results 1 to 5 of 5

1
A simple and novel method for the evaluation of adhesion properties between UV curable resin and stamp in UV-nanoimprint lithography (UV-NIL)

Heo, Jung-Chul; Kim, Kwang-Seop; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.98, pp.64 - 69, 2012-10

2
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test

Kim, Kwang-Seop; Kang, Ji-Hoon; Choi, Dae-Geun; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.88, no.6, pp.855 - 860, 2011-06

3
Effects of Temperature on the Microscale Adhesion Behavior of Thermoplastic Polymer Film

Kim, Kwang-Seop; Heo, Jung-Chul; Kim, Kyung-Woong, TRIBOLOGY LETTERS, v.38, no.2, pp.97 - 106, 2010-05

4
Effects of thermal treatment on the tribological characteristics of thermoplastic polymer film

Kim, Kwang-Seop; Heo, Jung-Chul; Kim, Kyung-Woong, THIN SOLID FILMS, v.519, no.18, pp.5988 - 5995, 2011-07

5
Shape design sensitivity analysis and optimization of two-dimensional periodic thermal problems using BEM

Lee, DH; Kwak, Byung Man, COMPUTATIONAL MECHANICS, v.29, no.2, pp.98 - 106, 2002-08

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