Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject FATIGUE
Showing results 1 to 25 of 25
| A novel description of thermomechanical behavior using a rheological model Lee, KO; Hong, SG; Lee, Soon-Bok, FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.306-308, pp.205 - 210, 2006 |
| A PHENOMENOLOGICAL MODEL FOR INTERGRANULAR FAILURE BY R-TYPE AND WEDGE-TYPE CAVITATION Lee, Soon-Bok; MILLER, AK, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.117, no.3, pp.311 - 321, 1995-07 |
| A Study on Estimation of Joint Force Through Isometric Index Finger Abduction With the Help of SEMG Peaks for Biomedical Applications Na, Youngjin; Choi, Changmok; Lee, Hae Dong; Kim, Jung, IEEE TRANSACTIONS ON CYBERNETICS, v.46, no.1, pp.2 - 8, 2016-01 |
| A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01 |
| A wellness platform for stereoscopic 3D video systems using EEG-based visual discomfort evaluation technology Kang, Min-Koo; Cho, Hohyun; Park, Han-Mu; Jun, Sung-Chan; Yoon, Kuk-Jin, APPLIED ERGONOMICS, v.62, pp.158 - 167, 2017-07 |
| An Automated Procedure for Determining Crack Opening Level from Differential Displacement Signal Data c.y.kim; Song, Ji Ho, INTERNATIONAL JOURNAL OF FATIGUE, v.15, no.4, pp.301 - 309, 1993 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Chraracteristics of crack growth of alumina ceramics under cyclic loads Huh Y.H.; Cho S.J.; Song, Ji Ho, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.17, no.8-9, pp.1737 - 1743, 2003-04 |
| Cognitive responses and cortical oscillatory processing at various stereoscopic depths –a simultaneous EEG/MEG study Cho, Hohyun; Kang, Min-Koo; Ahn, Sangtae; Kwon, Moonyoung; Yoon, Kuk-Jin; Kim, Kiwoong; Sung, Chan Jun, Journal of Integrative Neuroscience, v.16, no.3, pp.255 - 273, 2017-03 |
| Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 |
| Developing new intermuscular coordination patterns through an electromyographic signal-guided training in the upper extremity Seo, Gang; Park, Jeong-Ho; Park, Hyung-Soon; Roh, Jinsook, JOURNAL OF NEUROENGINEERING AND REHABILITATION, v.20, no.1, 2023-09 |
| Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices Lee, Tae-Ik; Jo, Woosung; Kim, Wansun; Kim, Ji-Hye; Paik, Kyung-Wook; Kim, Taek-Soo, ACS APPLIED MATERIALS & INTERFACES, v.11, no.14, pp.13416 - 13422, 2019-04 |
| Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes Jang, Kyung-Lim; Kim, Sanwi; Jeong, Byeong-Heon; Oh, Jong-Gil; Hong, Bo Ki; Kim, Taek-Soo, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.16, pp.11644 - 11653, 2017-04 |
| Evaluation of the impregnation characteristics of carbon fiber-reinforced composites using dissolved polypropylene Han, Song Hee; Oh, Hyun Ju; Kim, Seong Su, COMPOSITES SCIENCE AND TECHNOLOGY, v.91, pp.55 - 62, 2014-01 |
| Experimental study for reliability of electronic packaging under vibration Ham, SJ; Lee, Soon-Bok, EXPERIMENTAL MECHANICS, v.36, no.4, pp.339 - 344, 1996-12 |
| FATIGUE-STRENGTH AND FRACTURE MECHANISM OF CERAMIC-METAL JOINTS UNDER CYCLIC BENDING Lee, Soon-Bok; Kobayashi, H; Huh, JW, INTERNATIONAL JOURNAL OF FATIGUE, v.17, no.6, pp.427 - 435, 1995-08 |
| First Lateral Contact Probing of 55-μm Fine Pitch Micro-Bumps Kim, Chang-Keun; Yoon, Yong Hoon; Kwon, Donguk; Kim, Seunghwan; Yoon, Gun-Wook; Rhee, Min Woo; Yun, Jinyeong; et al, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.27, no.6, pp.1114 - 1123, 2018-12 |
| Long-term reliable physical health monitoring by sweat pore-inspired perforated electronic skins Yeon, Hanwool; Lee, Haneol; Kim, Yeongin; Lee, Doyoon; Lee, Youngjoo; Lee, Jong-Sung; Shin, Jiho; et al, SCIENCE ADVANCES, v.7, no.27, 2021-06 |
| Mechanical failures of Two-Dimensional materials on polymer substrates Chae, Kwanbyung; Nguyen, Van Tu; Lee, Sangryun; Phung, Thi Quynh; Sim, Yumin; Seong, Maeng-Je; Lee, Sangwoon; et al, APPLIED SURFACE SCIENCE, v.605, 2022-12 |
| Power-Assistive Finger Exoskeleton With a Palmar Opening at the Fingerpad Heo, Pilwon; Kim, Jung, IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, v.61, no.11, pp.2688 - 2697, 2014-11 |
| Surface Electromyography Characteristics for Motion Intention Recognition and Implementation Issues in Lower-limb Exoskeletons Kyeong, Seulki; Feng, Jirou; Ryu, Jae Kwan; Park, Jung Jae; Lee, Kyeong Ha; Kim, Jung, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.20, no.3, pp.1018 - 1028, 2022-03 |
Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability Oh, Yong Suk; Choi, Hyesun; Lee, Jaeho; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung Uk; Yun, Kyeong-Soo; et al, SCIENTIFIC REPORTS, v.7, 2017-09 |
| THE TORQUE TRANSMISSION CAPABILITIES OF THE ADHESIVELY-BONDED TUBULAR SINGLE LAP JOINT AND THE DOUBLE LAP JOINT CHOI, JH; Lee, Dai Gil, JOURNAL OF ADHESION, v.44, no.3, pp.197 - 212, 1994 |
| 복합재료 샌드위치 구조용 기계적 접합부의 피로 및 충격 특성에 관한 연구 = A study on the fatigue and impact characteristics of the mechanical joints for composite sandwich structureslink 임태성; Lim, Tae-Seong; et al, 한국과학기술원, 2004 |
| 전자패키지 Ball grid array 소더 조인트의 기계적 피로 특성에 관한 연구 = A study on mechanical fatigue behaviors of ball grid array solder joints for electronic packaginglink 박태상; Park, Tae-Sang; et al, 한국과학기술원, 2004 |
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- 4,057 2020 - 2024
- 12,348 2010 - 2019
- 10,785 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989