Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject FAILURE MECHANISMS
Showing results 1 to 2 of 2
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Damage tolerance of composite toecap Lee, SM; Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.67, no.2, pp.167 - 174, 2005-02 |
Discover
Open Access
Date issued
- 4,050 2020 - 2024
- 12,348 2010 - 2019
- 10,785 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989