Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectFAILURE MECHANISMS

Showing results 1 to 2 of 2

1
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

2
Damage tolerance of composite toecap

Lee, SM; Lim, TS; Lee, Dai Gilresearcher, COMPOSITE STRUCTURES, v.67, no.2, pp.167 - 174, 2005-02

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