Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectDESIGNS

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3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Jo, Mansik; Bae, Seunghwan; Oh, Injong; Jeong, Ji-hun; Kang, Byoungsoo; Hwang, Seok Joon; Lee, Seung-Seobresearcher; et al, ACS NANO, v.13, no.11, pp.12500 - 12510, 2019-11

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