Browse "Dept. of Mechanical Engineering(기계공학과)" bySubjectDEFECT ANALYSIS

Showing results 1 to 4 of 4

Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test

Kim, Kwang-Seop; Kang, Ji-Hoon; Choi, Dae-Geun; Kim, Kyung-Woongresearcher, MICROELECTRONIC ENGINEERING, v.88, no.6, pp.855 - 860, 2011-06

Effects of Temperature on the Microscale Adhesion Behavior of Thermoplastic Polymer Film

Kim, Kwang-Seop; Heo, Jung-Chul; Kim, Kyung-Woongresearcher, TRIBOLOGY LETTERS, v.38, no.2, pp.97 - 106, 2010-05

Effects of thermal treatment on the tribological characteristics of thermoplastic polymer film

Kim, Kwang-Seop; Heo, Jung-Chul; Kim, Kyung-Woongresearcher, THIN SOLID FILMS, v.519, no.18, pp.5988 - 5995, 2011-07

Molecular simulation study on adhesions and deformations for Polymethyl Methacrylate (PMMA) resist in nanoimprint lithography

Kwon, Sungjin; Lee, Youngmin; Park, Jaeshin; Im, Seyoungresearcher, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.25, no.9, pp.2311 - 2322, 2011-09



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