Showing results 1 to 3 of 3
A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 |
Novel method for measuring a wear scar using deep learning Lee, Sebin; Kim, Taewan; Lee, Seungchul; Hong, Sung-Ho, TRIBOLOGY INTERNATIONAL, v.190, 2023-12 |
Three Dimensional Upper Limb Joint Kinetics of a Golf Swing with Measured Internal Grip Force Choi, Hyeob; Park, Sukyung, SENSORS, v.20, no.13, 2020-07 |
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