Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Ha C.-W.
Showing results 1 to 3 of 3
| A complete solution to asymmetric S-curve motion profile: Theory & experiments Ha C.-W.; Rew K.-H.; Kim, Kyung-Soo, 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2845 - 2849, 2008-10-14 |
| Improving reliability of lateral thermosonic flip-chip bonding with ACF Ha C.-W.; Kim, Kyung-Soo, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.36 - 39, 123, 2009-12-09 |
| Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF) Jang T.-Y.; Ha C.-W.; Kim, Kyung-Soo, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.113 - 117, 2009-11-17 |
Discover
Open Access
Date issued
- 4,057 2020 - 2024
- 12,348 2010 - 2019
- 10,785 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989