Browse "Dept. of Mechanical Engineering(기계공학과)" by Author R.H. Dauskardt
Showing results 1 to 11 of 11
| Functionally Graded Hybrid Layers for High-Performance Polymer/Silicon Adhesion Kim, Taek-Soo; Giachino, M; N. Ananthakrishnan; S.M. Liff; R.H. Dauskardt, Materials Research Society 2011 Spring Meeting, Materials Research Society, 2011-04-25 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, Materials Research Society 2010 Spring Meeting, Materials Research Society, 2010-04-05 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, 2010 NCCAVS CMPUG, NCCAVS CMPUG, 2010-04-28 |
| Optimized CMP for Device Structure Containing Ultra-Low-k Dielectrics Kim, Taek-Soo; R.H. Dauskardt, SEMICON Korea, SEMICON, 2009-01-20 |
| Optimized CMP of Nanomaterials Kim, Taek-Soo; R.H. Dauskardt, 215th Electrochemical Society Meeting, Electrochemical Society, 2009-05-24 |
| Optimizing CMP for Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 2008-01-01 |
| Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, IEEE International Interconnect Technology Conference , IEEE, 2008-06-01 |
| Quantitative Roadmap for Optimizing CMP of Ultralow-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Tuning Depth Profiles of Low-k Dielectrics with UV Curing Kim, Taek-Soo; Tsuji, N; van der Hilst, J; Matsushita, K; Kobayashi, N; Chumakov, D; Geisler, H; et al, Advanced Metallization Conference, Advanced Metallization Conference, 2008-01-01 |
| Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
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