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Showing results 1 to 13 of 13

1
A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs

Lee, Soon-Bok; Paik, KW; Jeon, YD; Yang, SY; Kwon, YM, Pan Pacific Microelectronics symposium, 2005

2
Die Shear test of the coined solder bumps package with various UBM and solder materials

Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003

3
Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006

4
Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs

Jeon, Young Doo; Yang, Se Young; Paik, KW; Lee, Soon-Bok, IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006-12

5
Experimental analysis on the mechanism of moisture induced interface weakening in ACF package

Sim, Gidong; Chung, CK; Paik, KW; Lee, Soon-Bok, European Microelectronics and Packaging Conference, EMPC 2009, European Microelectronics and Packaging Conference, EMPC 2009, 2009-06-15

6
Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry

Park, JH; Jang, JW; Jang, KW; Paik, KW; Lee, Soon-Bok, 2009 European Microelectronics and Packaging Conference, EMPC 2009, EMPC, 2009-06-15

7
Nemerical Analysis of Coined Eutectic Solder Bumps

Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002

8
Numerical Simulation of the Formation of Coined Solder Bump

Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001

9
Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09

10
Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18

11
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09

12
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008

13
Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications

Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

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