Browse "Dept. of Mechanical Engineering(기계공학과)" byAuthorHa T.H.

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1
Low temperature hybrid bonding using self-alignment

Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Yoo C.D.researcher, 3rd Electronics System Integration Technology Conference, ESTC 2010, 2010-09-13

2
Pre-bonding method using self-alignment effect for multichip packaging

Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Cha M.S.; Yoo C.D.researcher, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.118 - 123, 2009-11-17

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